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New-Style fiber laser scribing machine
New design: Reconstruct the mechanical structure to make the device structure more compact, easier to use, more ergonomic. Rewrite the part of the fiber laser scribing machine software source code to make software run more stable and faster.
High Configuration: Using 20W fiber laser, make the beam quality better (standard base model), kerf finer (30μm), and more smooth edge.
Free-maintenance: machine using standard modular design, the real free-maintenance uninterrupted continuous operation, without wasting replacement of wearing parts.
Easy operation: an integrated air-cooled device settings, device smaller, more simple operation.
Dedicated control software: specifically for laser scribing machine designed control software, easy to operate, can be displayed in real time dicing path.
High efficiency: maximum efficiency scribing speed can up to 200mm / s.
Application and marketing
Suit for Scribing and cutting monocrystalline silicon, polycrystalline silicon, amorphous silicon cells and dicing of silicon, germanium, gallium arsenide semiconductor material.
| Model specification | PEDB-20H |
| Laser Power | 20W |
| Laser Wavelength | 1064nm |
| Precision Dicing | ±10μm |
| Dicing linewidth | ≤30μm |
| Laser repetition frequency | 20KHz~100KHz |
| Max scribing Speed | 200mm/s |
| Working area | 210mm×210mm |
| Power Supply | 220V/ 50Hz/ 2.5KVA |
| Cooling way | Wind Cooling |
| Working table | Single gas warehouse vacuum adsorption |
New design: Reconstruct the mechanical structure to make the device structure more compact, easier to use, more ergonomic. Rewrite the part of the fiber laser scribing machine software source code to make software run more stable and faster.
High Configuration: Using 20W fiber laser, make the beam quality better (standard base model), kerf finer (30μm), and more smooth edge.
Free-maintenance: machine using standard modular design, the real free-maintenance uninterrupted continuous operation, without wasting replacement of wearing parts.
Easy operation: an integrated air-cooled device settings, device smaller, more simple operation.
Dedicated control software: specifically for laser scribing machine designed control software, easy to operate, can be displayed in real time dicing path.
High efficiency: maximum efficiency scribing speed can up to 200mm / s.
Application and marketing
Suit for Scribing and cutting monocrystalline silicon, polycrystalline silicon, amorphous silicon cells and dicing of silicon, germanium, gallium arsenide semiconductor material.