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| Model specification | PEDB-10HD | PEDB-20HD |
| Laser Power | 10W | 20W |
| Laser Wavelength | 1064nm | |
| Precision Dicing | ±10μm | |
| Dicing linewidth | ≤30μm | |
| Laser repetition frequency | 20KHz~100KHz | |
| Max scribing Speed | 160mm/s | 200mm/s |
| Working area | 350mm×350mm | |
| Power Supply | 380V(220V)/ 50Hz/ 3.5KVA | |
| Cooling way | Wind cooling | |
| Working table | Double gas warehouse vacuum adsorption, T-bit dual work can alternate | |
New design: Reconstruct the mechanical structure to make the device structure more compact, easier to use. Rewrite the part of the fiber laser scribing machine software source code to make software run more stable and faster.
High Configuration: Using 20W fiber laser, make the beam quality better (standard base model), kerf finer (30μm), and more smooth edge.
Free-maintenance: machine using standard modular design, the real free-maintenance uninterrupted continuous operation, without wasting replacement of wearing parts.
Easy operation: an integrated air-cooled device settings, device smaller, more simple operation.
Dedicated control software: specifically for laser scribing machine designed control software, easy to operate, can be displayed in real time dicing path.
High efficiency: T-station duplex alternating operation, improve work efficiency dicing maximum speed up to 200mm / s
Application and Market
? Able to adapt to silicon, polycrystalline silicon, amorphous silicon cells and dicing of silicon, germanium, gallium arsenide semiconductor material scribing and cutting.